本标准协助企业实现其供应链社会责任管理体系的预期结果，为企业自身、其客户、其供应商以及其他利益相关者创造价值。这些预期结果包括： 改进供应链的工作条件、环保绩效和道德水平 履行社会责任合规义务，降低供应链风险和成本 实现社会责任目标，包括提升客户满意度、企业及其供应链的竞争优势
Products
在群焊过程中，所有焊点均达到最低焊接（再流焊）温度是重要的以确保焊料合金和被焊基底金属之间形成冶金结合而达到焊接。冶金结合要求被焊接的两表面以及焊料需达到最低焊接温度并且维持充足的时间，以使焊料表面润湿。本文件提供了适当的温度曲线测试工具与有关温度曲线的各种技术和方法指南。共18页， 于2001年5月发行。
This is the Japanese language version of J-STD-005. Lists requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Supersedes QQ-S-571. Developed by IPC and EIA. 24 pages. Released January 1995.
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards