Products
IPC/JEDEC J-STD-035A test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic devices. IPC/JEDEC J-STD-035A method provides users with an acoustic microscopy process flow for detecting anomalies (delaminations, cracks, mold compound voids, etc.) nondestructively in encapsulated electronic devices while achieving reproducibility
IPC-2222B used in conjunction with IPC-2221, establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. The IPC-2222B standard applies to single-sided, double-sided, or multi-layered boards. Key concepts in IPC-2222B are rigid laminate properties, design requirements for printed board assembly and...
This standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common...
Controlled impedance is the maintenance of some specified tolerance in the characteristic impedance of an interconnect line (transmission line) that is used to connect different devices on a circuit. Controlled impedance is often a design consideration for high-speed digital or high-frequency analog circuits. This guide is intended to be used by circuit designers, packaging engineers, printed...
Developed by the OEM council of the IPC, the MQP sets the standard for assessing PWB manufacturer capabilities and allows PCB manufacturers to more easily satisfy customer requirements. This document eases auditing processes and reduces the frequency of audits, thereby decreasing paperwork and enhancing manufacturer effectiveness. Revision A consists of a single, easy to use electronic file...
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ‘‘special’’ electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for...
This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select...
The IPC-A-640A standard provides acceptance requirements and technical insight that have been removed from acceptance standards for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. The IPC-A-640A is intended for use by the design engineer, manufacturing engineer, quality engineer and other individuals responsible for tailoring specific...
IPC-9252 defines levels of appropriate testing and assists in the selection of the test analyzer, test parameters, test data and fixturing required to perform electrical test(s) on unpopulated printed boards and innerlayers. Revision B provides new requirements for resistive and indirect continuity and isolating testing, test record marking and traceability and an updated sample electrical test...
IPC-4204B establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed boards. It encompasses 12 specification sheets that result from the combinations of various copper foil claddings; a polymer base dielectric selected from polyesters, polyimides, liquid crystal...
IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-4203B does not cover non...
IPC-7526A handbook addresses understencil cleanliness during stencil printing, removal of solder paste from stencils following the cleaning process and misprint PCB board cleaning considerations.
IPC-2226A, Sectional Design Standards for High Density Interconnect (HDI) Printed Boards is used in conjunction with IPC-2221B. The IPC-2226A standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and microvia technology. Revision A constitutes a substantial update to the document, with an all new color key for HDI constructions, new...
The IPC-1921A handbook provides problems, causes and possible corrective actions related to printed board manufacturing processes. Includes more than 200 photos and illustrations depicting common defects.
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will...
The IPC-4202C standard covers the requirements for flexible base materials, herein referred to as laminates, prepregs or films, to be used primarily for flexible printed boards for electrical and electronic circuits
IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits. In addition to better definitions of inclusions and how to properly classify them; redefine "substrates" as, "fabricated sheets"; and a more proper definition...
This guideline describes flexibility and stretchability testing to evaluate printable electronics for stretchable and wearable applications. 26 pages. Released March 2017
Establishes the general requirements for documentation necessary to fully describe end product printed boards, regardless of raw material, special fabrication requirements, layer count or end product usage. Includes master drawing requirements, board definition and artwork/phototooling. 94 pages. Revised May 1995.
This specification establishes the certification requirements for facilities that inspect/test printed boards, components and materials. This specification is intended to provide a minimum standardized basis for evaluating or auditing a technically oriented inspection/testing facility. Revised November 1997. 15 pages.
IPC-1730A is a tool used to categorize a laminate manufacturer's capabilities, which furnishes customer access to detailed information. Used for single or multiple sites or locations, IPC-1730A simplifies auditing processes and reduces the frequency of audits, decreasing paperwork and improving efficiency. The program includes a description, approval and certification profile and a quality profile...
This document standardizes the requirements for power conversion devices (PCDs) for the computer and telecommunications industries. The phrase “power conversion devices” refers to ac to dc and dc to dc modules, converters and power supplies. This specification sets the requirements for design; qualification testing; conformance testing and manufacturing quality/reliability processes, but does not...
IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and...
This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on...
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards