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Document #:

IPC-HM-860

Revision

Original Version

Product Type

Standard Only

Released: 01/01/1987

Language

English

Current Revision

Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements. 66 pages. Released January 1987.

Document #:

IPC-9631

Revision

Original Version

Product Type

Standard Only

Released: 12/15/2010

Language

English

Current Revision

IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and...

Document #:

IPC-D-351

Revision

Original Version

Product Type

Standard Only

Released: 08/01/1985

Language

English

Current Revision

Describes an intelligent, digital format for transfer of drawings between printed wiring board designers, manufacturers and customers. Also conveys additional requirements, guidelines and examples necessary to provide the data structures and concepts for drawing description in digital form. Supplements ANSI/IPC-D-350. Pertains to four basic types of drawings: master drawings, schematics, assembly...

Document #:

IPC-D-352

Revision

Original Version

Product Type

Standard Only

Released: 08/01/1985

Language

English

Current Revision

Describes the relationship between elements used in electromechanical design and packaging of printed boards. Includes descriptions for logical and physical elements necessary as input to a design system, as well as the network of interconnection description between the various electronic parts. Provides the capability of describing all elements in their final form upon design completion. The...

Document #:

IPC-D-355

Revision

Original Version

Product Type

Standard Only

Released: 01/01/1995

Language

English

Current Revision

Describes an intelligent, digital data transfer format for describing component mounting information. Supplements IPC-D-350 and is for designers and assemblers. Data included are pin location, component orientation, etc. This document is frozen; no future updates are planned. 33 pages. Released January 1995.

Document #:

IPC-J-STD-048

Revision

Original Version

Product Type

Standard Only

Released: 05/02/2015

Language

English

Current Revision

This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers to manage and mitigate the disruption caused by the discontinuation of a product and to ensure continuity of supply. This standard establishes the requirements for timely customer notification of planned...

Document #:

IPC-D-354

Revision

Original Version

Product Type

Standard Only

Released: 02/01/1987

Language

English

Current Revision

Describes the usage of libraries within the processing and generation of information files. The data contained within covers both the definition and usage of internal (existing within the information file) and external libraries. The libraries can be used to make generated data more compact and facilitate data exchange and archival. The subroutines within a library can be used one or more times...

Document #:

IPC-5702

Revision

Original Version

Product Type

Standard Only

Released: 06/01/2007

Language

English

Current Revision

Every electronics manufacturer, whether an original equipment manufacturer (OEM) or electronics manufacturing services (EMS) company, must determine if the unpopulated printed boards entering the assembly process have an adequate level of cleanliness. The question of “how clean is clean enough?” is one that has no definitive answer, as there is no "golden number" for board cleanliness. The issue...

Document #:

IPC-7711/21

Revision

Product Type

Standard Only

Released: 02/01/2017

Language

English

This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.

Document #:

IPC-A-600

Revision

Product Type

Standard Only

Released: 03/12/2021

Language

French

Current Revision

LʼIPC-A-600K est le guide illustré de référence sur lʼacceptabilité des circuits imprimés ! LʼIPC-A-600K est un document en quatre couleurs fournissant des photographies et des illustrations de la cible, des conditions « objectif », acceptables et non conformes qui sont observables en interne ou en externe sur des circuits imprimés nus. Veillez à ce que vos opérateurs, inspecteurs et ingénieurs...

Document #:

IPC-1601

Revision

Product Type

Standard Only

Released: 06/27/2016

Language

English

The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking profiles...

Document #:

IPC-7095

Revision

Product Type

Standard Only

Released: 01/28/2013

Language

English

Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures...

Document #:

IPC-1782

Revision

Product Type

Standard Only

Released: 01/13/2021

Language

English

The IPC-1782A standard establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782A applies to all products, processes, assemblies, parts, components, equipment and other items used in the manufacture of printed board assemblies and in mechanical assembly.

Document #:

IPC-A-600

Revision

Product Type

Standard Only

Released: 03/09/2021

Language

Spanish

Current Revision

El IPC-A-600K es la guía ilustrada definitiva de admisibilidad de las placas impresas. El IPC-A-600K es un documento a cuatro colores donde se recogen fotografías e ilustraciones de las condiciones objetivo, aceptables y no conformes que son observables de forma interna o externa en placas impresas vacías. Verifique que sus operadores, inspectores e ingenieros dispongan de la más actualizada...

Document #:

IPC-A-600

Revision

Product Type

Standard Only

Released: 01/18/2021

Language

German

Current Revision

IPC-A-600K-DE ist das ultimative, illustrierte Handbuch für Annahmekriterien von Leiterplatten! Diese Richtlinie im Vierfarb-Druck enthält Bilder und Illustrationen der Zustände „Anzustreben“, „Zulässig“ und „Fehler“, die an unbestückten Leiterplatten im Innern oder auf der Oberfläche beobachtbar sind. Stellen Sie sicher, dass Ihre Mitarbeiter, Prüfer und Ingenieure über die aktuellste Version...

Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 06/30/2015

Language

French

Current Revision

Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...

Document #:

IPC-DR-572

Revision

Product Type

Standard Only

Released: 03/01/2007

Language

English

This document provides guidelines for generating good quality holes in printed circuit boards (PCBs) made from a wide variety of materials. It addresses the following topics: Drill Bits, Tooling, Drilling Stacked Materials, Drilling Machines, Drilling Operation, Drilled Hole Quality and Trouble Shooting. 12 pages. Released March 2007.

Document #:

IPC-7095

Revision

Product Type

Standard Only

Released: 04/02/2008

Language

English

Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats. This has become especially important due to the change in the alloys being used, both...

Document #:

IPC-7095

Revision

Product Type

Standard Only

Released: 10/01/2004

Language

English

Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. Revision A of this document delivers useful and practical information to anyone who is currently using BGAs or is considering a conversion to area array packaging formats. In addition to providing guidelines for BGA inspection...

Document #:

IPC-A-600

Revision

Product Type

Standard Only

Released: 03/15/2024

Language

Thai

Current Revision

ภาพประกอบใช้เป็นคู่มือเพื่อแสดงการยอมรับได้ของบอร์ดพิมพ์! เอกสารสี่สีนี้ได้ให้ภาพถ่ายและภาพประกอบที่แสดงถึงสภาวะเป้าหมาย ยอมรับได้ และ ไม่สอดคล้องตามข้อกำหนด ซึ่งสามารถสังเกตเห็นได้ทั้งจากภายในหรือภายนอกบนบอร์ดพิมพ์เปล่า ตรวจสอบให้แน่ใจว่าผู้ปฏิบัติงาน ผู้ตรวจสอบ และวิศวกรของคุณมีข้อมูลที่เป็นเอกฉันทามติของอุตสาหกรรมที่เป็นปัจจุบันที่สุด ด้วยรูปถ่ายและภาพประกอบใหม่หรือที่มีการแก้ไขจำนวนมาก...

Document #:

IPC-A-600

Revision

Product Type

Standard Only

Released: 10/16/2020

Language

Chinese

Current Revision

IPC-A-600K是印制板可接受性的权威图示说明！IPC-A-600K是一份四色文档，提供了目标的照片和插图，可以在裸露的印刷电路板上内部或外部观察到的可接受和不符合的条件。确保您的操作员，检查员和工程师具有最新的行业共识信息。IPC-A-600K提供了数十种新的或经过修订的照片和插图，涵盖了诸如开裂，背钻结构，边缘连接器连接盘，铜包裹板，镀层空隙和微小异常，微孔目标连接盘穿刺，内层分离和镀层悬垂。该文档与IPC-6012E和IPC-6013D中表达的可接受性要求保持同步。取代IPC-A-600J。

Document #:

IPC-A-600

Revision

Product Type

Standard Only

Released: 02/20/2024

Language

Vietnamese

Current Revision

Những hướng dẫn được minh họa có tính định nghĩa cho khả năng chấp nhận đối với bảng mạch in! Tài liệu 4 màu này cung cấp các bức ảnh và các hình minh họa cho các tình trạng mục tiêu, chấp nhận và không phù hợp đối với các tình trạng quan sát được bên trong và bên ngoài bảng mạch in chưa lắp ráp. Hãy đảm bảo công nhân, người kiểm tra và các kỹ sư của bạn có được những thông tin đồng thuận mới nhất...

Document #:

IPC-6012

Revision

Product Type

Standard Only

Released: 04/13/2010

Language

English

Dual-language (Spanish/English) DVD -- Introduces industry specifications J-STD-001 & IPC-A-610 and explains the concept of process indicators. Includes an animated examination of the invisible problems that can be created during rework to explain why it's so important to avoid unnecessary rework. Reviews each of the tools and materials for plated-through hole (PTH) rework (including low-residue...

Document #:

IPC-1791

Revision

Product Type

Standard Only

Released: 03/22/2023

Language

English

IPC-1791C provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management (SCRM), security and chain of...

Document #:

IPC-A-600

Revision

Product Type

Standard Only

Released: 07/27/2021

Language

Chinese (Zhōngwén)

Current Revision

IPC-A-600K是印刷電路板可接受性的權威圖示說明！IPC-A-600K是一份四色文檔，提供了目標的照片和插圖，可以在裸露的印刷電路板上內部或外部觀察到的可接受和不符合的條件。確保您的操作員，檢查員和工程師具有最新的行業共識資訊。IPC-A-600K提供了數十種新的或經過修訂的照片和插圖，涵蓋了諸如開裂，背鑽結構，邊緣連接器連接盤，銅包裹板，鍍層空隙和微小異常，微孔目標連接盤穿刺，內層分離和鍍層懸垂。該文檔與IPC-6012E和IPC-6013D中表達的可接受性要求保持同步。取代IPC-A-600J。