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IPC-J-STD-005 - Standard with Amendment 1

Requirements for Soldering Pastes

Document #:
IPC-J-STD-005
Revision
Original Version
Product Type
Standard with amendment(s)
Released:  06/27/2008
Language
Chinese
This is the Chinese language version of J-STD-005. DOD Adopted 1995Lists requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Supersedes QQ-S-571. Developed by IPC and EIA. 24 pages. Released January 1995.

IPC-7530 - Standard Only

群焊工艺温度曲线指南（再流焊和波峰焊)

Document #:
IPC-7530
Revision
Original Version
Product Type
Standard Only
Released:  11/18/2016
Language
Chinese
在群焊过程中，所有焊点均达到最低焊接（再流焊）温度是重要的以确保焊料合金和被焊基底金属之间形成冶金结合而达到焊接。冶金结合要求被焊接的两表面以及焊料需达到最低焊接温度并且维持充足的时间，以使焊料表面润湿。本文件提供了适当的温度曲线测试工具与有关温度曲线的各种技术和方法指南。共18页， 于2001年5月发行。

IPC-J-STD-005 - Standard Only

Requirements for Soldering Pastes

Document #:
IPC-J-STD-005
Revision
Original Version
Product Type
Standard Only
Released:  05/05/2008
Language
Japanese
This is the Japanese language version of J-STD-005. Lists requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Supersedes QQ-S-571. Developed by IPC and EIA. 24 pages. Released January 1995.
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-8401: Guidelines for In-Mold Electronics

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly