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IPC-WP-019 - Revision B - White Paper

An Overview on Global Change in Ionic Cleanliness Requirements

Document #:
IPC-WP-019
Revision
B
Product Type
White Paper
Released:  10/07/2020
Language
English
Current Revision
The IPC-WP-019B white paper was created to support the IPC-J-STD-001H standard and provides additional guidance, examples, and understanding of Section 8.0 Cleaning and Residue Requirements. The IPC-WP-019B has information on how to meet the requirements of IPC-J-STD-001H chapter 8. Recommentded for those looking to implement the requirements of IPC-J-STD-001H standard, chapter 8. 0..
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IPC-WP-023 - White Paper

IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: The Hidden Reliability Threat

Document #:
IPC-WP-023
Revision
Original Version
Product Type
White Paper
Released:  05/01/2018
Language
English
Current Revision
IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures IPC-WP-023 white paper provides an investigation of these...

IPC-WP-021 - White Paper

Considerations of New Classes of Coatings for IPC-CC-830 Revision C

Document #:
IPC-WP-021
Revision
Original Version
Product Type
White Paper
Released:  12/16/2019
Language
English
Current Revision
The IPC-WP-021 white paper considers conformal coatings, like many high-performance materials, have evolved considerably since the 1990s. New coatings, such as fluoropolymers or hybrid coatings, have come on the market, many of which offer superior protection characteristics, but do not fit into the existing classifications of either MIL-I-46058 or IPC-CC-830. The IPC-WP-021 white paper discusses...

IPC-WP-026 - White Paper

IPC Technology Solutions White Paper on Blockchain and the Electronics Industry: A Review of the Current State of Blockchain Technology and Its Potential Applications in Electronics Manufacturing

Document #:
IPC-WP-026
Revision
Original Version
Product Type
White Paper
Released:  12/05/2019
Language
English
Current Revision
The IPC-WP-026 white paper explores blockchain as an emerging technology that has a core strength in providing an immutable, auditable, transparent and secure environment for data exchanges. These advantages make it a prime candidate for implementation in the electronics industry. The IPC-WP-026 white paper explores blockchain and its limitations and challenges. It also provides a few directions...

IPC-WP-024 - White Paper

IPC White Paper on Reliability and Washability of Smart Textile Structures – Readiness for the Market

Document #:
IPC-WP-024
Revision
Original Version
Product Type
White Paper
Released:  08/16/2018
Language
English
Current Revision
IPC-WP-024 is a white paper which discusses the issues associated with reliability of smart textiles (e-textiles structures) following multiple washing cycles and emphasizes efforts that industry and research laboratories must undertake to make e-textile structures more robust and able to be washed similarly to everyday textile products (e.g., underwear, clothing, home textiles and technical...

IPC-WP-025 - White Paper

IPC White Paper on A Framework for the Engineering and Design of E-Textiles

Document #:
IPC-WP-025
Revision
Original Version
Product Type
White Paper
Released:  04/01/2019
Language
English
Current Revision
This white paper is a benchmarking exercise of e-textile integrations, providing an introductory categorization of how the current market sector is using textile-based electrical components to achieve integrated functionality. This peer assessment provides a baseline understanding of e-textile process techniques, requirements and resources within this emerging sector.
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IPC/PERM-WP-022 - White Paper

Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin - Final Report

Document #:
IPC/PERM-WP-022
Revision
Original Version
Product Type
White Paper
Released:  09/05/2018
Language
English
Current Revision
Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reflowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reflow process. This phenomenon of tin...
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IPC-EMB - White Paper

Embedded Capacitor Technology; Status, Opportunity and Challenges

Document #:
IPC-EMB
Revision
Original Version
Product Type
White Paper
Released:  01/25/2012
Language
English
Current Revision
"Embedded Capacitor Technology; Status, Opportunity and Challenges" was presented by John Andresakis, vice president of strategic technology, Oak-Mitsui at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, Washington D.C., in December 2011.The author explains how the use of this technology improves the performance, reliability and assembly cost of printed boards and...
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IPC-SPVC - White Paper

Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots

Document #:
IPC-SPVC-TAL
Revision
Original Version
Product Type
White Paper
Released:  11/12/2009
Language
English
Current Revision
The IPC Solder Products Value Council’s Technical Subcommittee Report “Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots” reports on research on take action limits of solder pot contamination for SAC305 lead-free solder. As opposed to one maximum contamination level, the IPC SPVC opted to identify three action levels: Normal operation defined as the...
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IPC-WP-016 - White Paper

IPC Round Robin Study

Document #:
IPC-WP-016
Revision
Original Version
Product Type
White Paper
Released:  02/07/2013
Language
English
Current Revision
A discussion was held in the 5-33AWG (ad hoc working group), on things that conformal coat professionals (materials and processes) wish designers knew about conformal coating. The 5-33AWG group is comprised of individuals from OEMs, coating suppliers, and test lab personnel.

IPC-WP-019 - Revision A - White Paper

An Overview on the Global Change in Ionic Cleanliness Requirements

Document #:
IPC-WP-019
Revision
A
Product Type
White Paper
Released:  10/12/2018
Language
English
IPC-WP-019A a revised white paper provides an overview of ionic cleanliness requirements, providing examples of tests and requirements for acceptability from a residue/cleanliness standpoint. The history of ROSE testing is also provided, with explanations of the shortcomings of that testing.
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IPC-TR-587 - Standard Only

Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment Report

Document #:
IPC-TR-587
Revision
Original Version
Product Type
Study/Technical Report
Released:  08/04/2020
Language
English
Current Revision
IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized. IPC-TR-587 is a report outlining an IPC study of...
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IPC-582 - Study/Report

Cleaning & Cleanliness Test Program for Phase 3-Low Solids Fluxes & Pastes Processed in Ambiant Air

Document #:
IPC-TR-582
Revision
Original Version
Product Type
Study/Technical Report
Released:  10/02/2018
Language
English
Current Revision
This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing. This Phase 3 effort has been dedicated to characterizing...

IPC-TR-583 - Study/Report

An In-Depth Look At Ionic Cleanliness Testing

Document #:
IPC-TR-583
Revision
Original Version
Product Type
Study/Technical Report
Released:  07/01/2002
Language
English
Current Revision
This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continued importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final...

IPC-TR-486 - Study/Report

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

Document #:
IPC-TR-486
Revision
Original Version
Product Type
Study/Technical Report
Released:  07/01/2001
Language
English
Current Revision
This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 51 pages...
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IPC-TR-465-3 - Study/Report

Evaluation of Steam Aging on Alternative Finishes, Phase 11A

Document #:
IPC-TR-465
Revision
Original Version
Product Type
Study/Technical Report
Released:  07/01/1996
Language
English
Current Revision
Details the results of a two-year study to determine the effect of steam aging exposure on components. A variety of solderable finishes were used. A small production simulation utilized preconditioned and as-received samples and tested a total of 2,000 joints. 15 pages. Released July 1996.
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IPC-TR-001 - Study/Report

An Introduction to Tape Automated Bonding Fine Pitch Technology

Document #:
IPC-TR-001
Revision
Original Version
Product Type
Study/Technical Report
Released:  01/01/2006
Language
English
Current Revision
This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989.
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IPC-TR-467 - Study/Report

Supporting Data and Numerical Examples for ANSI/J-STD-001B APPENDIX D (Control of Fluxes)

Document #:
IPC-TR-467
Revision
Original Version
Product Type
Study/Technical Report
Released:  10/01/1996
Language
English
Current Revision
This addendum to J-STD-001, originally developed for Revision B but also applicable to Revision C, proposes solutions for cost-effective testing and increased implementation. Also covers other assembly test methods that are not addressed in J-STD-001. 12 pages. Released October 1996. Now available in electronic format.

IPC-TR-579 - Study/Report

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

Document #:
IPC-TR-579
Revision
Original Version
Product Type
Study/Technical Report
Released:  09/01/1988
Language
English
Current Revision
Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated. 80 pages. Released September 1988.
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IPC-TR-549 - Study/Report

Measles in Printed Wiring Boards

Document #:
IPC-TR-549
Revision
Original Version
Product Type
Study/Technical Report
Released:  12/02/2014
Language
English
Current Revision
An IPC Blue Ribbon Committee originally published this study. It provides extensive background and test results resolving methods to identify visible conditions such as measles in PWBs and that measles do not impact reliability. 81 Pages. Released November 1973.
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IPC-TR-587 - Standard Only

Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment Report

Document #:
IPC-TR-587
Revision
Original Version
Product Type
Study/Technical Report
Language
English
Current Revision
IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized. IPC-TR-587 is a report outlining an IPC study of...
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IPC-WP-019 - Revision B - White Paper

综述全球离子洁净度要求的变更

Document #:
IPC-WP-019
Revision
B
Product Type
White Paper
Released:  04/13/2022
Language
Chinese
Current Revision
本白皮书 IPC WP-019B 旨在支持 J-STD-001 修订版 H，并提供额外的指导、示例和对第 8.0 节清洁和残留物要求的理解。 推荐给那些希望实现 J-STD-001 8.0 要求的人。
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IPC-WP-019 - Revision A - White Paper

Una visión de conjunto sobre el cambio global de requisitos de limpieza iónica

Document #:
IPC-WP-019
Revision
A
Product Type
White Paper
Released:  03/13/2019
Language
Spanish
Current Revision
IPC-WP-019A, un libro blanco revisado que proporciona una visión de conjunto sobre los requisitos de limpieza iónica, junto con ejemplos de pruebas y de requisitos para la aceptabilidad en cuanto a limpieza o presencia de residuos. Presenta también un resumen de la historia de la prueba de ROSE junto con explicaciones sobre las limitaciones de esta prueba.
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IPC-WP-019 - Revision A - White Paper

Présentation des modifications générales des exigences en matière de propreté ionique

Document #:
IPC-WP-019
Revision
A
Product Type
White Paper
Released:  03/13/2019
Language
French
Current Revision
La révision du livre blanc IPC-WP-019A présente les exigences en matière de propreté ionique, avec des exemples de tests et d’exigences pour l’acceptabilité du point de vue des résidus/de la propreté. Un historique des tests ROSE est également fourni, accompagné d’explications relatives aux défauts que présentent ces tests.
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

J-STD-005B: Requirements for Soldering Pastes

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

J-STD-004D: Requirements for Soldering Fluxes

IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly