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IPC-WP-023 - White Paper

IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: The Hidden Reliability Threat

Document #:
IPC-WP-023
Revision
Original Version
Product Type
White Paper
Released:  05/01/2018
Language
English
Current Revision
IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures IPC-WP-023 white paper provides an investigation of these...
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IPC/PERM-WP-022 - White Paper

Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin - Final Report

Document #:
IPC/PERM-WP-022
Revision
Original Version
Product Type
White Paper
Released:  09/05/2018
Language
English
Current Revision
Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reflowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reflow process. This phenomenon of tin...
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IPC-SPVC - White Paper

Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots

Document #:
IPC-SPVC-TAL
Revision
Original Version
Product Type
White Paper
Released:  11/12/2009
Language
English
Current Revision
The IPC Solder Products Value Council’s Technical Subcommittee Report “Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots” reports on research on take action limits of solder pot contamination for SAC305 lead-free solder. As opposed to one maximum contamination level, the IPC SPVC opted to identify three action levels: Normal operation defined as the...
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IPC-EMB - White Paper

Embedded Capacitor Technology; Status, Opportunity and Challenges

Document #:
IPC-EMB
Revision
Original Version
Product Type
White Paper
Released:  01/25/2012
Language
English
Current Revision
"Embedded Capacitor Technology; Status, Opportunity and Challenges" was presented by John Andresakis, vice president of strategic technology, Oak-Mitsui at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, Washington D.C., in December 2011.The author explains how the use of this technology improves the performance, reliability and assembly cost of printed boards and...
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IPC-TR-549 - Study/Report

Measles in Printed Wiring Boards

Document #:
IPC-TR-549
Revision
Original Version
Product Type
Study/Technical Report
Released:  12/02/2014
Language
English
Current Revision
An IPC Blue Ribbon Committee originally published this study. It provides extensive background and test results resolving methods to identify visible conditions such as measles in PWBs and that measles do not impact reliability. 81 Pages. Released November 1973.
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IPC-582 - Study/Report

Cleaning & Cleanliness Test Program for Phase 3-Low Solids Fluxes & Pastes Processed in Ambiant Air

Document #:
IPC-TR-582
Revision
Original Version
Product Type
Study/Technical Report
Released:  10/02/2018
Language
English
Current Revision
This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing. This Phase 3 effort has been dedicated to characterizing...

IPC-TR-583 - Study/Report

An In-Depth Look At Ionic Cleanliness Testing

Document #:
IPC-TR-583
Revision
Original Version
Product Type
Study/Technical Report
Released:  07/01/2002
Language
English
Current Revision
This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continued importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final...

IPC-TR-486 - Study/Report

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

Document #:
IPC-TR-486
Revision
Original Version
Product Type
Study/Technical Report
Released:  07/01/2001
Language
English
Current Revision
This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 51 pages...
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IPC-TR-465-3 - Study/Report

Evaluation of Steam Aging on Alternative Finishes, Phase 11A

Document #:
IPC-TR-465
Revision
Original Version
Product Type
Study/Technical Report
Released:  07/01/1996
Language
English
Current Revision
Details the results of a two-year study to determine the effect of steam aging exposure on components. A variety of solderable finishes were used. A small production simulation utilized preconditioned and as-received samples and tested a total of 2,000 joints. 15 pages. Released July 1996.
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IPC-TR-001 - Study/Report

An Introduction to Tape Automated Bonding Fine Pitch Technology

Document #:
IPC-TR-001
Revision
Original Version
Product Type
Study/Technical Report
Released:  01/01/2006
Language
English
Current Revision
This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989.
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IPC-TR-467 - Study/Report

Supporting Data and Numerical Examples for ANSI/J-STD-001B APPENDIX D (Control of Fluxes)

Document #:
IPC-TR-467
Revision
Original Version
Product Type
Study/Technical Report
Released:  10/01/1996
Language
English
Current Revision
This addendum to J-STD-001, originally developed for Revision B but also applicable to Revision C, proposes solutions for cost-effective testing and increased implementation. Also covers other assembly test methods that are not addressed in J-STD-001. 12 pages. Released October 1996. Now available in electronic format.

IPC-TR-579 - Study/Report

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

Document #:
IPC-TR-579
Revision
Original Version
Product Type
Study/Technical Report
Released:  09/01/1988
Language
English
Current Revision
Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated. 80 pages. Released September 1988.
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IPC-TR-586 - Standard Only

Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

Document #:
IPC-TR-586
Revision
Original Version
Product Type
Study/Technical Report
Released:  03/01/2009
Language
English
This technical report provides the documentation of a round robin testing effort that generated data used by the 4-14 Plating Processes Subcommittee in developing the maximum immersion silver plating thickness requirement in the revision A of IPC-4553. This compendium of data resulted from three information sets: a) Test vehicle assembly report by Celestica, b) Thermal cycle test report by...
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-8401: Guidelines for In-Mold Electronics

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly