Technical Reports & White Papers

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Document #:

IPC-WP-019

Revision

Product Type

White Paper

Released: 10/07/2020

Language

English

Current Revision

The IPC-WP-019B white paper was created to support the IPC-J-STD-001H standard and provides additional guidance, examples, and understanding of Section 8.0 Cleaning and Residue Requirements. The IPC-WP-019B has information on how to meet the requirements of IPC-J-STD-001H chapter 8. Recommentded for those looking to implement the requirements of IPC-J-STD-001H standard, chapter 8. 0..

Document #:

IPC-WP-014

Revision

Product Type

White Paper

Released: 04/07/2020

Language

English

Current Revision

Pb-free materials are considered a major technology disruption to traditional Pb-based interconnect materials for electronics, which is of particular concern for the aerospace & defense industries where safety cannot be compromised and applicable reliability data remains scarce. Until validated data and modelling methods are developed, projects considering Pb-free Aerospace & Defense products and...

Document #:

IPC-WP-012

Revision

Original Version

Product Type

White Paper

Released: 05/02/2014

Language

English

Current Revision

Lead-free electronics continues to be a concern of the aerospace, defense, and high performance products (ADHP) industries. This is primarily due to the lack of data and knowledge to: thoroughly categorize performance under harsh service conditions and provide a level of confidence in reliability assessments of Pb-free electronics equal to those for traditional tin-lead electronics. To help close...

Document #:

IPC-WP-015

Revision

Original Version

Product Type

White Paper

Released: 04/01/2014

Language

English

Current Revision

The PERM Lead-Free Manhattan Project (LFMP) was established to identify the technology and knowledge gaps relevant to the implementation of commercially available Pb-free product in Aerospace & Defense Systems. These knowledge gaps threaten to affect the safety, performance and reliability of Aerospace & Defense systems, which cannot be compromised. Investment is required to close these knowledge...

Document #:

IPC-WP-023

Revision

Original Version

Product Type

White Paper

Released: 05/01/2018

Language

English

Current Revision

IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures IPC-WP-023 white paper provides an investigation of these...

Document #:

IPC-WP-021

Revision

Original Version

Product Type

White Paper

Released: 12/16/2019

Language

English

Current Revision

The IPC-WP-021 white paper considers conformal coatings, like many high-performance materials, have evolved considerably since the 1990s. New coatings, such as fluoropolymers or hybrid coatings, have come on the market, many of which offer superior protection characteristics, but do not fit into the existing classifications of either MIL-I-46058 or IPC-CC-830. The IPC-WP-021 white paper discusses...

Document #:

IPC/PERM-WP-022

Revision

Original Version

Product Type

White Paper

Released: 09/05/2018

Language

English

Current Revision

Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reﬂowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reﬂow process. This phenomenon of tin...

Document #:

IPC-WP-003

Revision

Original Version

Product Type

White Paper

Released: 08/01/1993

Language

English

Current Revision

Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John...

Document #:

IPC-RFP

Revision

Original Version

Product Type

White Paper

Released: 01/18/2012

Language

English

Current Revision

"Is Your RFP D.O. A." was presented at the IPC Conference for the PCB Industry: Critical Issues for the Military Market in December 2011 by Steve DeWaters, president, Penumbra Strategies, Inc. The author describes the procedures of the military in preparing an RFP and evaluating the proposals. He also describes the procedures to create an effective response to the RFP and some of the pitfalls of...

Document #:

IPC-EMB

Revision

Original Version

Product Type

White Paper

Released: 01/25/2012

Language

English

Current Revision

"Embedded Capacitor Technology; Status, Opportunity and Challenges" was presented by John Andresakis, vice president of strategic technology, Oak-Mitsui at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, Washington D.C., in December 2011.The author explains how the use of this technology improves the performance, reliability and assembly cost of printed boards and...

Document #:

IPC-SPVC-TAL

Revision

Original Version

Product Type

White Paper

Released: 11/12/2009

Language

English

Current Revision

The IPC Solder Products Value Council’s Technical Subcommittee Report “Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots” reports on research on take action limits of solder pot contamination for SAC305 lead-free solder. As opposed to one maximum contamination level, the IPC SPVC opted to identify three action levels: Normal operation defined as the...

Document #:

IPC-WP-016

Revision

Original Version

Product Type

White Paper

Released: 02/07/2013

Language

English

Current Revision

A discussion was held in the 5-33AWG (ad hoc working group), on things that conformal coat professionals (materials and processes) wish designers knew about conformal coating. The 5-33AWG group is comprised of individuals from OEMs, coating suppliers, and test lab personnel.

Document #:

IPC-WP-017

Revision

Original Version

Product Type

White Paper

Released: 10/30/2015

Language

English

Current Revision

This technical paper covers the testing and evaluation of polymeric conformal coatings for moisture and insulation resistance (MIR) and dielectric withstanding voltage (DWV). This effort was initiated by the IPC Conformal Coating Task Group to support technical decisions for IPC coating specification CC-830 as part of the Revision C process. MIR testing was done per a modified method of IPC-TM-650...

Document #:

IPC-WP-009

Revision

Original Version

Product Type

White Paper

Released: 05/14/2009

Language

English

Current Revision

As most of the world converts to lead-free manufacturing, the concern over tin whiskers as a reliability hazard has grown due to the emergence of pure tin as a dominate component surface finish. A significant amount of research on tin whisker formation and tin whisker mitigating strategies has been performed in both commercial and defense industries. This working paper is a summary of the...

Document #:

IPC-WP-019

Revision

Product Type

White Paper

Released: 10/12/2018

Language

English

IPC-WP-019A a revised white paper provides an overview of ionic cleanliness requirements, providing examples of tests and requirements for acceptability from a residue/cleanliness standpoint. The history of ROSE testing is also provided, with explanations of the shortcomings of that testing.

Document #:

IPC-TR-587

Revision

Original Version

Product Type

Study/Technical Report

Released: 08/04/2020

Language

English

Current Revision

IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized. IPC-TR-587 is a report outlining an IPC study of...

Document #:

IPC-TR-582

Revision

Original Version

Product Type

Study/Technical Report

Released: 10/02/2018

Language

English

Current Revision

This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing. This Phase 3 effort has been dedicated to characterizing...

Document #:

IPC-TR-583

Revision

Original Version

Product Type

Study/Technical Report

Released: 07/01/2002

Language

English

Current Revision

This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continued importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final...

Document #:

IPC-TR-486

Revision

Original Version

Product Type

Study/Technical Report

Released: 07/01/2001

Language

English

Current Revision

This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 51 pages...

Document #:

IPC-TR-465

Revision

Original Version

Product Type

Study/Technical Report

Released: 07/01/1996

Language

English

Current Revision

Details the results of a two-year study to determine the effect of steam aging exposure on components. A variety of solderable finishes were used. A small production simulation utilized preconditioned and as-received samples and tested a total of 2,000 joints. 15 pages. Released July 1996.

Document #:

IPC-TR-585

Revision

Original Version

Product Type

Study/Technical Report

Released: 05/01/2006

Language

English

Current Revision

This Technical Report details the investigations into identifying stress tests that distinguish between robust and non-robust surface finishes. A robust finish will pass a test for solderability whereas a non-robust finish will fail. The stress tests identified do not necessarily duplicate real world environment (fabrication of the bare printed board through assembly), but they must correlate to...

Document #:

IPC-TR-001

Revision

Original Version

Product Type

Study/Technical Report

Released: 01/01/2006

Language

English

Current Revision

This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989.

Document #:

IPC-TR-467

Revision

Original Version

Product Type

Study/Technical Report

Released: 10/01/1996

Language

English

Current Revision

This addendum to J-STD-001, originally developed for Revision B but also applicable to Revision C, proposes solutions for cost-effective testing and increased implementation. Also covers other assembly test methods that are not addressed in J-STD-001. 12 pages. Released October 1996. Now available in electronic format.

Document #:

IPC-TP-1113

Revision

Original Version

Product Type

Study/Technical Report

Released: 01/01/1994

Language

English

Current Revision

A Technical Paper by Dr. Jack Brous discussing ionic cleanliness measurement, testing methods and cleanliness standards in relation to product reliability. Also includes a brief discussion of no-clean fluxes. 8 pages. Released 1994

Document #:

IPC-TR-579

Revision

Original Version

Product Type

Study/Technical Report

Released: 09/01/1988

Language

English

Current Revision

Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated. 80 pages. Released September 1988.