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"PWB Technology Roadmap" was presented by Lance Auer, product development engineering, Raytheon Missile Systems Division, at the IPC Conference for the PCB Industry: Critical Issues for the Military Market in Washington D.C., in December 2011.The author explores the developing challenges of PCB design. Design types, digital, power and high speed RF circuits present conflicting requirements of more...
The IPC 2015 International Technology Roadmap provides vision and direction for product and process development and the services required to satisfy current and future needs of companies that design, build, buy or specify electronic equipment and materials. The IPC Roadmap is an invaluable resource for any person or company in or having interest in the global electronics supply chain. It is an...
Based on data from 118 electronics assembly companies and PCB fabricators worldwide, this report presents data on the current state (2016) of PCB fabrication and assembly, and the industry’s predictions for the data by 2021. The data are segmented by five applications: automotive, defense and aerospace, high-end systems, industrial and medical electronics. Topics covered include board properties...
PCB Technology Trends 2023 is based on data from 60 respondents (26 electronics OEMs, 16 PCB fabricators, 12 EMS companies and 6 "other" industry segment participants) worldwide. PCB Technology Trends 2022 presents data on the current state of PCB fabrication and OEM's PCB requirements and their use of emerging technologies. Predictions from both industry segments indicate how these measurements...
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IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards