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IPC-1754 - Standard with Amendment 1

Materials and Substances Declaration for Aerospace and Defense and Other Industries

Document #:
IPC-1754
Revision
Original Version
Product Type
Standard with amendment(s)
Released:  04/26/2019
Language
English
IPC-1754 WAM 1 Materials and Substances Declaration for Aerospace and Defense and Other Industries establishes the requirements for exchanging material and substance data for products between suppliers and their customers for Aerospace and Defense, Heavy Equipment and other industries. This standard covers the process for exchanging data on chemical substances (“Substances”) that may be present in...

IPC-1755 - Standard with Amendment 1 & 2

Conflict Minerals Data Exchange Standard

Document #:
IPC-1755
Revision
Original Version
Product Type
Standard with amendment(s)
Released:  05/04/2017
Language
English
This document establishes a standard reporting format for exchange of information between supply chain participants about conflict minerals contained in suppliers' products and supports reporting at the company and product level, as mutually agreed upon between partners.
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IPC-1755 - Standard with Amendment 1

Conflict Minerals Data Exchange Standard

Document #:
IPC-1755
Revision
Original Version
Product Type
Standard with amendment(s)
Released:  04/14/2015
Language
English
Amendment 1 to IPC-1755 Conflict Minerals Data Exchange establishes a standard reporting format for exchange of information between supply chain participants about conflict minerals contained in suppliers' products. IPC-1755 supports reporting at the company and product level, as mutually agreed upon between partners. 30 pages. Released April 2015. Please "Add to Cart" to download this item. You...
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IPC-1754 - Standard with Amendment 1

Materials and Substances Declaration for Aerospace and Defense and Other Industries

Document #:
IPC-1754
Revision
0
Product Type
Standard with amendment(s)
Language
English
IPC-1754 WAM 1 Materials and Substances Declaration for Aerospace and Defense and Other Industries establishes the requirements for exchanging material and substance data for products between suppliers and their customers for Aerospace and Defense, Heavy Equipment and other industries. This standard covers the process for exchanging data on chemical substances (“Substances”) that may be present in...
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IPC/JEDEC-J-STD-020 - Revision D - Standard with Amendment 1

非气密固态表面贴装器件潮湿/再流焊敏感度分级

Document #:
IPC/JEDEC-J-STD-020
Revision
D
Product Type
Standard with amendment(s)
Released:  01/15/2010
Language
Chinese
简要介绍 （英文） J-STD-020D.1新增了无铅组装所用元器件的相关内容！本标准的目的是确定对湿气诱发应力敏感的非气密固态表面贴装器件（SMD）的潮湿敏感等级。它可用于确定SMD封装的初始可靠性认证应该采用的分级等级。从而能够对这些器件进行正确地包装、存储和操作，以避免其在随后的再流焊接操作时受到热/机械损伤。本标准由IPC和JEDEC联合开发，全文共24页，于 2008年3月公布。

IPC-J-STD-001 - Revision F - Standard with Amendment 1

焊接的电气和电子组件要求修订版F附修订本1

Document #:
IPC-J-STD-001
Revision
F
Product Type
Standard with amendment(s)
Released:  04/13/2017
Language
Chinese
IPC J-STD-001F是全球公认的唯一一份达成行业共识的涵盖焊接材料和工艺的标准。F版本既支持传统焊料合金制造，也支持无铅制造。显著变化的例子如新版本修订了镀覆孔(PTH)的最小填充的要求、两种新型SMT焊端的要求以及敷形涂覆的要求。对于生产高质量的焊接互连与组件，本标准描述已尽可能的调整，使材料、方法和验证更容易理解。本标准包含了三个级别产品的要求。配有全彩插图。此标准是IPC-A-610F的补充，由IPC-HDBK-001提供配套支持。全文70页，J-STD-001F附修订本1，2016年2月发布，2016年12月翻译。
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IPC-J-STD-004 - Revision B - Standard with Amendment 1

はんだ付用フラックスに関する要求事項

Document #:
IPC-J-STD-004
Revision
B
Product Type
Standard with amendment(s)
Released:  12/05/2019
Language
Japanese
本規格は、高品質のはんだ相互接続に使用するフラックスの分類および特性評価に関し、一般的な要求事項を規定するものである。本規格は、品質管理および購入目的のために使用することも可能である。本規格の目的は、プリント回路基板組立において電子冶金学的な相互接続に用いるための、すず/鉛および鉛フリーはんだ付のフラックス材料を分類し特性評価をするものである。はんだ付用のフラックス材料には以下を含む：液体フラックス、ペーストフラックス、ソルダペースト、クリームはんだ、ならびにフラックスコーティングされたはんだおよびやに入り糸はんだおよびプリフォーム。 許容可能とされるフラックスまたははんだ付の材料を排除することは、本規格の意図するところではない。しかしながら、これらの材料は、要求される電気的および冶金学的な相互接続をもたらす必要がある。

IPC-J-STD-003 - Revision C - Standard with Amendment 1

印制板可焊性测试

Document #:
IPC-J-STD-003
Revision
C
Product Type
Standard with amendment(s)
Released:  04/05/2016
Language
Chinese
J-STD-003C规定了用于评估印制板表面导体、连接盘和镀覆孔可焊性的测试方法和缺陷定义，并附有相关的图表。本标准适用于供应商和用户。本标准所规定的可焊性测试方法的目标是确定印制板表面导体、连接盘及镀覆孔被焊料润湿的难易程度和经受苛刻的印制板组装工艺的能力。描述了评定表面导体、连接盘和镀覆孔可焊性所采用的测试方法。C版本包含了可焊性量具可再现性和可重复性的最新信息，同时更新了插图 修订本1纠正了编辑错误并在文档许多地方增加了澄清声明。全文共27页，2014年发布。2015年11月

IPC-J-STD-006 - Revision B - Standard with Amendments 1 & 2

电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

Document #:
IPC-J-STD-006
Revision
B
Product Type
Standard with amendment(s)
Released:  10/22/2009
Language
Chinese
简要介绍 （英文） 本文件阐述了应用于电子焊接领域的电子级焊料合金、含助焊剂与不含助焊剂的棒状、带状、粉末状焊料及专用电子级焊料的命名原则、要求及测试方法。本文件是一个质量控制文件，无意直接关联制造工艺中材料的性能。对于应用于非电子领域的焊料，应该按照ASTM B-32的规定进行采购。 本文件是三项联合工业标准之一，这三项联合工业标准阐述了电子工业所用焊接材料的要求和测试方法。其它两份标准是：IPC/EIA J-STD-004 助焊剂要求；IPC/EIA J-STD-005 焊膏要求。全文共29页，2009年10月正式发布英文版； J-STD-006B附修订本1和2（2011年8月出版中文版）修改了以下内容： 1. 增加引用文件IPC/JEDEC J-STD-609《元器件、印制电路板和印制电路板组件的有铅、无铅及其它属性的标记和标签》。 2. 阐明指定为无铅合金的意思。 3...

EIA/IPC/JEDEC-J-STD-002 - Revision C - Standard with Amendment 1

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

Document #:
EIA/IPC/JEDEC-J-STD-002
Revision
C
Product Type
Standard with amendment(s)
Released:  03/20/2009
Language
Chinese
This is the Chinese Language version of J-STD-002C. This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. This standard addresses both visual acceptance and force measurement solderability criteria for both tin-lead as well as lead-free...

IPC-CC-830 - Revision B - Standard with Amendment 1

Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

Document #:
IPC-CC-830
Revision
B
Product Type
Standard with amendment(s)
Released:  11/06/2008
Language
Chinese
This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic...
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IPC-J-STD-005 - Standard with Amendment 1

Requirements for Soldering Pastes

Document #:
IPC-J-STD-005
Revision
Original Version
Product Type
Standard with amendment(s)
Released:  06/27/2008
Language
Chinese
This is the Chinese language version of J-STD-005. DOD Adopted 1995Lists requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Supersedes QQ-S-571. Developed by IPC and EIA. 24 pages. Released January 1995.
26-37 of 37

Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

J-STD-005B: Requirements for Soldering Pastes

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

J-STD-004D: Requirements for Soldering Fluxes

IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly