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IPC-7711/21 - Revision B - Standard Only

Rework, modifikation og reparation af elektronikprodukter

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  12/19/2012
Language
Danish
Current Revision
Stor opdatering af blyfri support og forbedrede inspektionsvejledninger for reparationer og modifikationer! Denne vejledning omfatter alt, der er nødvendigt for reparation og rework af elektronikprodukter og printkort! IPC-7711B/7721B „Rework, modifikation og reparation af elektronikprodukter“ har komplette procedurer, som er blevet opdaterede for at sikre, at de er anvendelige til både blyfri og...
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IPC-7711/21 - Revision C - Standard Only

Rework, modificatie en repair van elektronische assemblages - Chapter 1

Document #:
IPC-7711/21
Revision
C
Product Type
Standard Only
Released:  04/26/2019
Language
Dutch
Current Revision
Omschrijving in het Nederlands Deze handleiding bevat procedures voor rework, repair en modificatie van geassembleerde printplaten. Inbegrepen in deze revisie zijn de eerder uitgebrachte procedures met wijzigingspagina's, een bijgewerkte sectie van de algemene informatie en gemeenschappelijke procedures, nieuwe procedures voor BGA's met behulp van gerichte IR Reflow-systemen met geïntegreerde...
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IPC-7711/21 - Revision B - Standard Only

Rilavorazione, Modifica e Riparazione di Assemblati Elettronici

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  11/30/2007
Language
Italian
Current Revision
IPC-7711B/7721B rilavorazione, modifica e riparazione di assemblaggi elettronici un completo aggiornamento procedura per procedura al fine di garantirne l'applicabilità su entrambe le modalità di brasatura con Pb e senza Pb. Questo volume singolo include tutte le modifiche precedentemente pubblicate e diverse nuove procedure inerenti i BGA (compresi reballing) e la riparazione dei circuiti...

IPC-7711/21 - Revision B - Standard Only

Přepracování, modifikace a opravy elektronických sestav

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  01/27/2008
Language
Czech
Current Revision
Download an update to published IPC-7711B/7721B Part 3 Procedure 6.1.(English only) Základni aktualizace pro bezolovnatou technologii a zlepšené návody pro kontrolu oprav a modifikací Tento návod obsahuje vše, čeho je zapotřebí pro opravy a přepracování elektronických sestav a desek plošných spojů! IPC 7711/7721 Přepracování,modifikace a opravy elektronických sestav prošla kompletní aktualizaci...
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IPC-7711/21 - Revision B - Standard Only

Elektronik Takımlarda Yeniden İşlem, Modifikasyon ve Onarım

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  11/30/2007
Language
Turkish
Current Revision
IPC-7711/7721 Elektronik Takımlarda Yeniden İşlem, Modifikasyon ve Onarım, kurşunsuz ve geleneksel Kalay-Kurşun ile lehimli takımların her ikisi için de uygulanabilirliği sağlamak için prosedür bazında eksiksiz bir güncellemesi geçerli olmuştur. Bu tek cilt daha önce yayınlanan tüm değişiklikleri, BGA'lar için (topların yenilenmesini de içeren) yeni birkaç prosedürü ve esnek-baskı devre kartı...

IPC-7525 - Revision B - Standard Only

Designrichtlinie für Druckschablonen

Document #:
IPC-7525
Revision
B
Product Type
Standard Only
Released:  04/15/2013
Language
German
Current Revision
Dieses Dokument unterstützt Richtlinien für das Design und die Herstellung von Druckschablonen für Lotpasten und Kleber für die Oberflächenmontage für THT- und THT/SMD-Technologie. Darin eingeschlossen sind die Unterschiede zwischen bleihaltigen und bleifreien Lotpasten, Überdruckung, Doppeldruck und Stufenschablonen Designs. Enthalten sind ebenfalls Beispiele für ein Bestellformular und die...

IPC-SM-817 - Revision A - Standard Only

表面贴装用绝缘粘合剂通用规范

Document #:
IPC-SM-817
Revision
A
Product Type
Standard Only
Released:  10/29/2015
Language
Chinese
Current Revision
涵盖了从贴装到焊接制程用于固定元器件的绝缘粘合剂的要求和测试方法并作为印制板的一部分的长期性能。共9页。2014年12月发布。2015年6月翻译。

IPC-7711/21 - Revision B - Standard Only

Rework, Modification and Repair of Electronic Assemblies

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  03/23/2009
Language
Swedish
Current Revision
This is the Swedish language translation of IPC-7711B/7721B IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new procedures for BGAs (including reballing) and flex...

IPC-7711/21 - Revision B - Standard Only

Refacerea, Modificarea și Reparația Ansamblurilor Electronice

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  08/06/2012
Language
Romanian
Current Revision
DESCRIERE engleză IPC-7711B/7721B Refacerea, Modificarea și Reparația Ansamblurilor Electronice a fost în mod total revizuit, procedură cu procedură, pentru a se asigura aplicabilitatea atât pentru ansamblurile lipite tradițional cu aliaje SnPb cât și pentru cele fără plumb. Acest unic volum include toate modificările anterior publicate și câteva proceduri noi pentru circuite BGA (inclusiv...
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IPC-7525 - Revision C - Standard Only

模板设计指导 Stencil Design Guidelines

Document #:
IPC-7525
Revision
C
Product Type
Standard Only
Released:  11/01/2023
Language
Chinese
Current Revision
本标准是为设计与制造焊膏及表面贴装粘合剂用模板提供指导。本文件大部分内容是基于模板设计者、制造厂商和用户的经验编写的。

IPC-2291 - Standard Only

Design Guideline for Printed Electronics

Document #:
IPC-2291
Revision
Original Version
Product Type
Standard Only
Released:  07/30/2013
Language
English
This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products.The intent of IPC/JPCA-2291 is to establish a design process flow that will facilitate and improve the practice of printed electronics design. IPC/JPCA-2291 identifies documents such as standards that can be used to assist during the design process flow. 24...

IPC-2292 - Standard Only

Design Standard for Printed Electronics on Flexible Substrates

Document #:
IPC-2292
Revision
Original Version
Product Type
Standard Only
Released:  03/01/2018
Language
English
IPC-2292 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertaining to IPC-2292 standard, are materials or devices which have some amount of flexibility or bendability (not rigid) but are not considered to be stretchable (e.g., fabrics...
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IPC-7711/21 - Revision C - Redline Standard

Rework, Modification and Repair of Electronic Assemblies - Redline

Document #:
IPC-7711/21
Revision
C
Product Type
Redline Standard
Released:  05/30/2017
Language
English
This is a redline document showing the changes from IPC-7711/21B to IPC-7711/21C. This 790+ page document provides a side-by-side comparison of the two documents and includes the figures. The document shows the deleted/changed text in the IPC-7711/21B pages and the new/revised text in purple highlights in the IPC-7711/21C pages. Yellow pop-up boxes are also present in the IPC-7711/21C pages to...
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IPC-TM-650 - Standard Only

Method Development Packet

Document #:
IPC-TM-650
Revision
Original Version
Product Type
Development Packet
Released:  06/06/2012
Language
English
Current Revision
This document has been created to help define criteria that will yield better test methods for use by the electronics and related industries. Key objectives to validating a new test method procedure are covered, including the usage of objective evidence to verify that the elements defined within a method fulfill the intended use and that the method yields repeatable and reproducible results when...
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IPC-7711/21 - Revision C - Standard Only

Reparación, Modificación y Reparación de Ensambles Electrónicos

Document #:
IPC-7711/21
Revision
C
Product Type
Standard Only
Released:  01/08/2018
Language
Spanish
Esta guía proporciona procedimientos de retrabajo, reparación y modificación de ensambles de tablero impreso. Incluídos en esta revisión son los procedimientos previamente lanzados como páginas con cambios, una información general actualizada y sección de procedimientos comunes, nuevos procedimientos de BGAs utilizando sistemas enfocados de reflujo de infrarrojos con precalentadores y...
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IPC-7711/21 - Revision C - Standard Only

Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen

Document #:
IPC-7711/21
Revision
C
Product Type
Standard Only
Released:  11/28/2017
Language
German
Dieser Leitfaden enthält Verfahren für die Nacharbeit, Reparatur und Änderung von Leiterplatten-Baugruppen. In diese Ausgabe wurden die Verfahren integriert, die in die vorherige Ausgabe als Änderungsseiten aufgenommen wurden. Der Abschnitt Allgemeine Angaben und häufig angewendete Verfahren wurde aktualisiert. Neue Verfahren für BGAs wurden aufgenommen, die fokussierte IR-Reflow-Systeme mit...
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IPC-7711/21 - Revision C - Standard Only

Reprise, Modification et Réparation des Assemblages Électroniques

Document #:
IPC-7711/21
Revision
C
Product Type
Standard Only
Released:  11/16/2018
Language
French
Ce guide fournit des procédures de reprise, réparation et modification d’assemblages de circuits imprimés. Cette révision inclut les changements de pages des procédures publiées précédemment, une mise à jour de la section information générale et procédures communes, de nouvelles procédures pour les BGAs utilisant des Systèmes de Refusion par IR focalisés avec préchauffe intégrale et des mises à...
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IPC-7711/21 - Revision B - Standard Only

Procedures are additions to the IPC-7711B/7721B

Document #:
IPC-7711/21
Revision
B
Product Type
Update
Released:  02/01/2013
Language
English
These procedures are additions to the IPC-7711B/7721B. Section 2: 3.11.1; 5.7.6; 5.8.1.1; 5.8.1.2; 5.8.1.3; Section 3: 4.7.4; 4.7.5; all released November 2011. Section 2: 5.5.7 released February 2013. The pages herein are authorized for download, reproduction, and printing for insertion into the IPC- 7711B/7721B. These procedures are not intended for previous versions of IPC-7711/7721
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IPC-7711/21 - Revision C - Standard Only

電子組件的返工、修改和維修

Document #:
IPC-7711/21
Revision
C
Product Type
Standard Only
Released:  05/29/2020
Language
Chinese (Zhōngwén)
本指南提供了印刷電路板組件的返工，維修和修改程序。 本次修訂包括以前作為修訂本發布的程序，基本信息和通用程序部分的更新，使用具有預熱功能的聚焦紅外返工系統的BGA新程序，和所有其他程序的一般更新。許多規程包含彩色插圖。全文超過300頁。於2017年1月正式發布。2017年5月翻譯。

IPC-7711/21 - Revision C - Standard Only

电子组件的返工、修改和维修

Document #:
IPC-7711/21
Revision
C
Product Type
Standard Only
Released:  07/27/2017
Language
Chinese
本指南提供了印刷电路板组件的返工，维修和修改程序。 本次修订包括以前作为修订本发布的程序，基本信息和通用程序部分的更新，使用具有预热功能的聚焦红外返工系统的BGA新程序，和所有其他程序的一般更新。许多规程包含彩色插图。全文超过300页。于2017年1月正式发布。2017年5月翻译。

IPC-7525 - Revision B - Standard Only

模板设计指导

Document #:
IPC-7525
Revision
B
Product Type
Standard Only
Released:  02/26/2014
Language
Chinese
中文描述 本文件为设计与制造焊膏及表面贴装胶用模板提供 指导以及采用通孔或者倒装芯片器件的混装技术模 板设计，其中包括锡铅和无铅焊膏、套印、二次印 刷和阶梯模板设计之间的差别。该文件同时提供了 样品定购单和用户检验检查表
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-8401: Guidelines for In-Mold Electronics

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly