IPC-J-STD-001GA/A-610GA: Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G...
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IPC-J-STD-001GA/A-610GA: Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G...
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IPC-J-STD-001GS-AM1: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G. Requirements for Soldered Electrical...
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IPC-J-STD-001GS-AM1: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G. Requirements for Soldered Electrical...
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IPC-1791A: Trusted Electronic Designer, Fabricator and Assembler Requirements
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IPC-1791A: Trusted Electronic Designer, Fabricator and Assembler Requirements
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J-STD-005A-JP: ソルダペーストに関する要求事項
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J-STD-005A-JP: ソルダペーストに関する要求事項
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IPC/WHMA-A-620D: Requirements and Acceptance for Cable and Wire Harness Assemblies
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IPC/WHMA-A-620D: Requirements and Acceptance for Cable and Wire Harness Assemblies
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IPC-2591-Version 1.1: Connected Factory Exchange (CFX)
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IPC-2591-Version 1.1: Connected Factory Exchange (CFX)
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IPC-J-STD-001GS: Ergänzung Elektronik-Hardware für Raumfahrt- und Militäranwendungen zu IPC J-STD-001G Anforderungen an gelötete elektrische und...
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IPC-A-610GC: Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies
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IPC-HERMES-9852: 表面贴装技术组装中机器对机器通信的全球标准
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IPC-HERMES-9852: 表面贴装技术组装中机器对机器通信的全球标准
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IPC-J-STD-006C: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項
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IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項
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IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項
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IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項
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IPC-1072-AM1: Intellectual Property Protection in Electronic Assembly Manufacturing
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IPC-J-STD-001G-AM1: はんだ付される電気及び電子組立品に関する要件事項 改訂1
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IPC-4556-AM1: is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendment...
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IPC-J-STD-001G-AM1: Enthält Anforderungen für Lötmaterialien und -prozesse für elektronische Baugruppen.